Advanced Semiconductor Packaging 2024-2034: Forecasts, Technologies, Applications: IDTechEx

1. EXECUTIVE SUMMARY 1.1. Advanced semiconductor packaging technologies – our scope 1.2. Semiconductor foundries and their roadmap 1.3. Challenges in transistor scaling 1.4. Chiplets: Use cases and benefits 1.5. Four key drivers for advanced semiconductor packaging technologies 1.6. Key markets for advanced semiconductor packaging 1.7. Evolution roadmap of semiconductor packaging 1.8. Moving towards 3D packaging: Pros and Cons 1.9. Four key factors of advanced semiconductor packaging 1.10. Overview of interconnection technique in semiconductor packaging 1.11. Overview of 2.5D packaging structure 1.12. Tech development trend for 2.5D packaging 1.13. Benchmark of materials for interposer 1.14. Interposer supplier landscape 1.15. Advanced Semiconductor packaging – technology benchmark overview (1) 1.16. Advanced Semiconductor packaging – technology benchmark overview (2) 1.17. Evolution of bumping technologies 1.18. Bumpless Cu-Cu hybrid bonding 1.19. Overview of devices that make use of hybrid bonding 1.20. Challenges in 3D Hybrid bonding 1.21. Key applications of 3D SoIC packages 1.22. The emergence of co-packaged optics (CPO) 1.23. Co-packaged optics – package structure 1.24. Future applications of Monolithic 3D 1.25. Data center accelerator: advanced semiconductor packaging unit forecast 2022-2034 (shipment) 1.26. Data center CPU: advanced semiconductor packaging unit forecast 2022-2034 (shipment) 1.27. Advanced semiconductor packaging unit forecast for APE (application processor
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USPTO Kicks Off Semiconductor Engineering Pilot Method to Expedite Semiconductor Manufacturing Programs | McDonnell Boehnen Hulbert & Berghoff LLP

Now, the USPTO announced a new, no-price tag, pilot program that accelerates the assessment procedure for US patent applications relevant to semiconductor production. Setting up Friday, December 1, 2023, candidates can file a petition to take part in the pilot application. Petitions that correspond to qualifying non-provisional utility patent purposes, directed to “certain procedures and apparatuses for production semiconductor products,” will be highly developed out of switch for examination (accorded exclusive standing) until a initial action.

  • Qualifying apps need to be “non-continuing initial utility non-provisional applications” that may well optionally assert priority to a prior provisional application or 1 or extra international precedence purposes.
  • At least one declare of the qualifying application have to go over a system or an apparatus for manufacturing a semiconductor unit and correspond to 1 or a lot more of the technical ideas in H10 (Semiconductor Units Electrical Reliable-Point out Gadgets Not Otherwise Presented For) or H01L (Semiconductor Gadgets Not Coated by Class H10) in the Cooperative Patent Classification (CPC) program.
  • Applicants should file the petition to make distinctive (PTMS) with the application or entry into the national phase below 35 U.S.C. 371 or inside of 30 days of the submitting day or entry
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Enhancements in Semiconductor Technological know-how for Space Apps

Exploring the Most recent Enhancements in Semiconductor Know-how for Space Programs

Semiconductor know-how has been a cornerstone of technological improvements for decades, and its programs in area exploration are no exception. The latest developments in this discipline are pushing the boundaries of what is possible, enabling a lot more economical and reputable area missions.

One particular of the most considerable enhancements in semiconductor know-how for area purposes is the progress of radiation-hardened semiconductors. These gadgets are created to stand up to the harsh radiation natural environment in house, which can trigger conventional semiconductors to are unsuccessful. Radiation-hardened semiconductors are vital for the results of place missions, as they make sure the trustworthiness and longevity of the electronic devices onboard spacecraft.

The progress of these radiation-hardened semiconductors has been driven by the need for far more strong and trustworthy technology for place exploration. Traditional semiconductors are inclined to injury from high-electrical power particles in area, which can induce malfunctions or finish failure of electronic systems. This is a substantial worry for place missions, as the failure of a one component can jeopardize the overall mission.

To address this issue, scientists have been developing new materials and manufacturing processes to generate semiconductors

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